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Proceedings Paper

Laser cleaning of silicon membrane stencil masks
Author(s): Werner Zapka; R. Lilischkis; Hans P. Zappe
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Paper Abstract

Liquid film enhanced LF laser cleaning with XeCl- and KrF- excimer lasers was demonstrated to remove sub-micrometer SiO2, and Al2O3 particles from silicon wafer surfaces, and from silicon membrane stencil masks, the threshold fluences for LF laser cleaning were determined. The importance of controlled liquid film deposition for efficient cleaning is discussed.

Paper Details

Date Published: 3 February 2000
PDF: 5 pages
Proc. SPIE 3996, 16th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (3 February 2000); doi: 10.1117/12.377095
Show Author Affiliations
Werner Zapka, Xaar Jet AB (Sweden)
R. Lilischkis, Fachhochschule Kaiserslautern/Zweibruecken (Germany)
Hans P. Zappe, Univ. Freiburg (Germany)


Published in SPIE Proceedings Vol. 3996:
16th European Conference on Mask Technology for Integrated Circuits and Microcomponents
Uwe F. W. Behringer, Editor(s)

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