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Proceedings Paper

Cost analysis of 4x and 6x 9-in. reticles for future lithography
Author(s): Lloyd C. Litt; Michael E. Kling; Terry Perkinson
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Paper Abstract

Standardizing on reticle size is critical for semiconductor tool manufacturers and the semiconductor industry as a whole. The advantages of large reticles are well known: larger die and increased throughput. Although predictions of extremely large die have not yet been realized, the throughput implications remain valid. As large reticles have the potential to increase throughput, some proponents view them as potential cost savers. This work examines the implications of migrating from today's standard 6-inch reticles to 9-inch reticles. It explores the factors that drive reticle cost, and describes why larger reticles should cost more. The paper also describes the cost benefit of implementing larger masks. Comparing the expected cost of building the reticle to the potential cost savings of using the reticle in production provides significant insight into the problem of selecting the optimal reticle size. Finally, the paper presents an analysis of the impact of 6X reduction systems on the selection of reticle size.

Paper Details

Date Published: 30 December 1999
PDF: 12 pages
Proc. SPIE 3873, 19th Annual Symposium on Photomask Technology, (30 December 1999); doi: 10.1117/12.373319
Show Author Affiliations
Lloyd C. Litt, Motorola (United States)
Michael E. Kling, Motorola (United States)
Terry Perkinson, Motorola (United States)


Published in SPIE Proceedings Vol. 3873:
19th Annual Symposium on Photomask Technology
Frank E. Abboud; Brian J. Grenon, Editor(s)

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