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Proceedings Paper

High-resolution DUV inspection system for 150-nm generation masks
Author(s): Mitsuo Tabata; Hideo Tsuchiya; Yasushi Sanada; Takeshi Nishizaka; Hiroaki Hirazawa; Noboru Kobayashi; Hideo Nagai; Tomohide Watanabe; Katsuki Oohashi; Hiromu Inoue; Takehiko Nomura; Akira Ono
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Paper Abstract

In order to perform mask inspection with the high reliability for 150 nm-rule and below devices, the inspection system with high resolution is indispensable. The phase shift masks like DUV HT masks must also be inspected with high sensitivity. A next generation mask inspection system MC-3000 which used DUV optics has been developed, in order to achieve these requirement. The wavelength of this optics is 257 nm that is shorter than that of current UV inspection systems, and is nearly equal to that of current DUV lithography systems. Short wavelength light and high NA optics obtain high resolution, so the defect detection of 130 nm or less is attained. The special issues for the DUV optics were solved by several new techniques. This paper reports the system configuration, basic characteristics for defect detection and inspection performances.

Paper Details

Date Published: 30 December 1999
PDF: 9 pages
Proc. SPIE 3873, 19th Annual Symposium on Photomask Technology, (30 December 1999); doi: 10.1117/12.373309
Show Author Affiliations
Mitsuo Tabata, Toshiba Corp. (Japan)
Hideo Tsuchiya, Toshiba Corp. (Japan)
Yasushi Sanada, Toshiba Corp. (Japan)
Takeshi Nishizaka, Toshiba Corp. (Japan)
Hiroaki Hirazawa, Toshiba Corp. (Japan)
Noboru Kobayashi, Toshiba Corp. (Japan)
Hideo Nagai, Toshiba Corp. (Japan)
Tomohide Watanabe, Toshiba Corp. (Japan)
Katsuki Oohashi, Toshiba Corp. (Japan)
Hiromu Inoue, Toshiba Corp. (Japan)
Takehiko Nomura, Toshiba Corp. (Japan)
Akira Ono, Toshiba Corp. (Japan)


Published in SPIE Proceedings Vol. 3873:
19th Annual Symposium on Photomask Technology
Frank E. Abboud; Brian J. Grenon, Editor(s)

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