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Proceedings Paper

Crack growth monitoring in harsh environments by electrical potential measurements
Author(s): W. Randolph Lloyd; Walter G. Reuter; David M. Weinberg
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Paper Abstract

Electric potential measurement (EPM) technology offers an attractive alternative to conventional nondestructive evaluation for monitoring crack growth in harsh environments. Where conventional NDE methods typically require localized human interaction, the EPM technique developed at Idaho National Engineering and Environmental Laboratory can be operated remotely and automatically. Once a crack-like defect is discovered via conventional means, EPM can be applied to monitor local crack size changes. This is of particular interest in situations where an identified structural defect is not immediately rejectable from a fitness-for-service viewpoint, but due to operational and environmental conditions may grow to an unsafe size with continuing operation. If the location is in a harsh environment where periodic monitoring by normal means is either too costly or not possible, a very expensive repairs may be immediately mandated. However, the proposed EPM methodology may offer a unique monitoring capability that would allow for continuing service.

Paper Details

Date Published: 8 December 1999
PDF: 8 pages
Proc. SPIE 3852, Harsh Environment Sensors II, (8 December 1999); doi: 10.1117/12.372827
Show Author Affiliations
W. Randolph Lloyd, Idaho National Engineering and Environmental Lab./Lockheed Martin Idaho Technologies Co. (United States)
Walter G. Reuter, Idaho National Engineering and Environmental Lab./Lockheed Martin Idaho Technologies Co. (United States)
David M. Weinberg, Idaho National Engineering and Environmental Lab./Lockheed Martin Idaho Technologies Co. (United States)


Published in SPIE Proceedings Vol. 3852:
Harsh Environment Sensors II
Anbo Wang, Editor(s)

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