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Proceedings Paper

Analysis of residual stress in optical fiber
Author(s): Donald J. Wissuchek; Carl W. Ponader; James J. Price
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Paper Abstract

Residual stress in an optical fiber impacts several fiber properties, including reliability and geometry. The residual stress profile arises from a thermal expansion mismatch of the constituent materials, the tension applied during fiber forming, and the thermal profile experienced by the fiber during formation. The thermal profile of the fiber is determined by measuring the intensities of the two `defect' bands in the silica cladding of the fiber using Raman spectroscopy. Other studies have shown that the intensities of these bands increase with increasing fictive temperature and that these changes can be used to map changes in fictive temperatures across the fiber diameter. Optical birefringence is used to measure the residual stress profile of the fiber. The relationship between fictive temperature and fiber residual stress is explored for both straight fibers and fibers with a natural radius of curvature (curled fibers).

Paper Details

Date Published: 29 December 1999
PDF: 10 pages
Proc. SPIE 3848, Optical Fiber Reliability and Testing, (29 December 1999); doi: 10.1117/12.372783
Show Author Affiliations
Donald J. Wissuchek, Corning Inc. (United States)
Carl W. Ponader, Corning Inc. (United States)
James J. Price, Corning Inc. (United States)

Published in SPIE Proceedings Vol. 3848:
Optical Fiber Reliability and Testing
M. John Matthewson, Editor(s)

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