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Proceedings Paper

Crossover photonic switching network with CMOS/SEED smart pixel device and 2D optical fiber bundle array
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Paper Abstract

A 16 X 16 Crossover photonic switching network with hybrid integrated CMOS/SEED smart pixel device and 2D optical fiber bundle array I/O access device is reported in this paper. SEEd array devices ar used as light receivers and transmitters, while CMOS devices make efficient logical processing. 4 X 40 2D multilayer optical fiber bundle arrays are fabricated and are used as I/O access devices in the crossover photonic switching network. The center to center spacing between adjacent optical fibers in the same layer of the fiber array is 125micrometers , and the spacing between adjacent layers is 250micrometers . Displacing tolerance of the fiber bundle arrays is less than 4 micrometers and the angular tilt error is less than 0.03 degree. It has the feature of high density, high precision, array permutation and easy to couple with 2D CMOS/SEED smart pixel device.

Paper Details

Date Published: 12 November 1999
PDF: 7 pages
Proc. SPIE 3896, Design, Fabrication, and Characterization of Photonic Devices, (12 November 1999); doi: 10.1117/12.370372
Show Author Affiliations
Fengguang Luo, Huazhong Univ. of Science and Technology (China)
Mingcui Cao, Huazhong Univ. of Science and Technology (China)
Qiaoyan Hu, Huazhong Univ. of Science and Technology (China)
Anjun Wan, Huazhong Univ. of Science and Technology (China)
Jun Xu, Huazhong Univ. of Science and Technology (China)
Cong Deng, Huazhong Univ. of Science and Technology (China)
Deming Liu, Huazhong Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 3896:
Design, Fabrication, and Characterization of Photonic Devices

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