Share Email Print
cover

Proceedings Paper

Measurement of mounting-induced strain in high-power laser diode arrays
Author(s): Jens Wolfgang Tomm; Ralf Mueller; A. Baerwolff; Dirk Lorenzen
Format Member Price Non-Member Price
PDF $17.00 $21.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Thermally induced strain caused by device packaging is studied in high-power semiconductor laser arrays by a novel non-invasive technique. Measurements with intentionally strained laser array devices for 808 nm emission reveal spectral shifts of quantum-confined optical transitions in the optical active region. These shifts by up to 10 meV serve as a measure for strain and are compared with model calculations. We demonstrate that different packaging techniques cause different packaging-induced strains. We also show that the packaging-induced strain portion, which gets transmitted through the solder material, differs for different packaging technologies. An intentionally strain- reduced packaging technique is shown to transmit about one quarter of the potential packaging-induced strain towards the optical active layer, whereas another packaging technique, which provides highly reliable 'single-chip' devices is found to transmit about half of the potential amount. Spatially resolved measurements demonstrate strain gradients within the devices. Also temporal strain evolution is monitored. We show that 'the burn-in' is accompanied by strain accumulation whereas for long-term operation strain relaxation occurs.

Paper Details

Date Published: 12 November 1999
PDF: 9 pages
Proc. SPIE 3896, Design, Fabrication, and Characterization of Photonic Devices, (12 November 1999); doi: 10.1117/12.370311
Show Author Affiliations
Jens Wolfgang Tomm, Max-Born-Institut fuer Nichtlineare Optik und Kurzzeitspektroskopie (Germany)
Ralf Mueller, Max-Born-Institut fuer Nichtlineare Optik und Kurzzeitspektroskopie (Germany)
A. Baerwolff, Max-Born-Institut fuer Nichtlineare Optik und Kurzzeitspektroskopie (Germany)
Dirk Lorenzen, Jenoptik Laserdiode GmbH (Germany)


Published in SPIE Proceedings Vol. 3896:
Design, Fabrication, and Characterization of Photonic Devices
Marek Osinski; Soo-Jin Chua; Shigefusa F. Chichibu, Editor(s)

© SPIE. Terms of Use
Back to Top