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Proceedings Paper

MEMS millimeter-wave reconfigurable components
Author(s): Jung-Chih Chiao; Yiton Fu; Iao Mak Chio; Shengyong Cheng; Yoosin Kang
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Paper Abstract

We present microelectromechanical system (MEMS) RF component architectures that enable reconfigurable MEMS millimeterwave transceivers. In this paper, we focus on the component architectures for system integration. Different components, including reconfigurable Vee-antennas, planar impedance tuners, microswitches and variable capacitors, are demonstrated using the same three-polysilicon-layer processes. The reconfigurability of the Vee-antenna is demonstrated with beam-steering and beam-shaping functionality. The tuning ranges of planar backshort impedance tuners on different transmission lines are studied. We show that it is feasible to integrate the reconfigurable Vee-antenna with the planar impedance tuners. The mechanical architectures for microswitches, parallel- plate variable capacitors and circular variable capacitors are also investigated.

Paper Details

Date Published: 12 November 1999
PDF: 9 pages
Proc. SPIE 3795, Terahertz and Gigahertz Photonics, (12 November 1999); doi: 10.1117/12.370211
Show Author Affiliations
Jung-Chih Chiao, Univ. of Hawaii/Manoa (United States)
Yiton Fu, Univ. of Hawaii/Manoa (United Kingdom)
Iao Mak Chio, Univ. of Hawaii/Manoa (United States)
Shengyong Cheng, Univ. of Hawaii/Manoa (United States)
Yoosin Kang, Univ. of Hawaii/Manoa (United States)

Published in SPIE Proceedings Vol. 3795:
Terahertz and Gigahertz Photonics
R. Jennifer Hwu; Ke Wu, Editor(s)

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