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Proceedings Paper

Performance test and analysis of silicon-based microchannel heat sink
Author(s): Shung-Wen Kang; Lung Jieh Yang; Chung-Sheng Yu; Jong-Shun Chen
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Paper Abstract

First, a micro cross flow heat sink made of (110)-orientated silicon is fabricated by bulk micromachining, and wafers with hundreds of high aspect ratio channels are bonded together by diffusion bonding with aluminum as medium layers. The core of the micro heat sink is about 0.918 cm-3, and the density of the heat transfer area if 15,294 m2/m3. Using pure water as the working fluid, as the maximum pressure drop reaches 2.47 bar, the flow rate is greater than 4.5 l/min, and that makes the overall heat transfer coefficient up to 24.7 kW/m2K, corresponds to a volumetric heat transfer coefficient of 188.5 MW/m3K. Second, we fabricate a series of 40 micrometers wide and 30 mm long micro channels with different aspect ratio is 12 cm2 (110) silicon wafer area. The silicon is anodic bonded with #7740 Pyrex glass to form the micro channel structure. Using pure water as the working fluid, hydraulic resistance and thermal performance of the micro channel structure are evaluated experimentally. As the maximum pressure drop reaches 3.3 bar, the flow rate is 0.3 l/min, and that make the heat transfer coefficient up to 32,598 W/m2K.

Paper Details

Date Published: 12 November 1999
PDF: 12 pages
Proc. SPIE 3795, Terahertz and Gigahertz Photonics, (12 November 1999); doi: 10.1117/12.370172
Show Author Affiliations
Shung-Wen Kang, Tamkang Univ. (Taiwan)
Lung Jieh Yang, Tamkang Univ. (Taiwan)
Chung-Sheng Yu, Tamkang Univ. (Taiwan)
Jong-Shun Chen, Tamkang Univ. (Taiwan)


Published in SPIE Proceedings Vol. 3795:
Terahertz and Gigahertz Photonics
R. Jennifer Hwu; Ke Wu, Editor(s)

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