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Proceedings Paper

X-Y nanopositioners using high-density arrays of mechanical oscillators
Author(s): Gilles Bourbon; Patrice Minotti; Philippe Helin; Hiroyuki Fujita
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Paper Abstract

Rapid positioning devices having nanometer accuracy are being used in the production of semiconductors. Micro- mechanical-oscillators made by silicon surface micromachining are expected to suit with such devices, according to their direct-drive capabilities. This communication investigates a first generation of microconveyers using high density arrays of micro- mechanical-oscillators. Densities as high as 1000 actuators/mm2 have been already achieved, therefore allowing shape recognition using tactile information on the near future. Thus, depending on the overall size of the conveyance system, millimeter size moving parts having different shapes are expected to be selected, and then independently distributed onto intelligent surfaces. The proposed conveyance system have been fabricated using a multi layer silicon surface micromachining process. Basically, electrodes are deposited onto a silicon substrate, in order to selectively address each elementary actuation cell. Each elementary cell is mechanically connected to a 1.2 micrometers thick polysilicon sheet frame which is deposited above distributed electrodes. The oscillators are activated by electrostatic force. The operating mechanism that is investigated in the communication is as follow: out-of-plane displacements of the frame are synchronized with the motion of mechanical oscillators, in order to allow the declutching mechanism which is needed to convey the moving part. The very first presented here allow us to expect a nanometer positioning resolution in open loop-control.

Paper Details

Date Published: 8 October 1999
PDF: 10 pages
Proc. SPIE 3893, Design, Characterization, and Packaging for MEMS and Microelectronics, (8 October 1999); doi: 10.1117/12.368463
Show Author Affiliations
Gilles Bourbon, Univ. of Franche-Comte (France)
Patrice Minotti, Univ. of Franche-Comte (France)
Philippe Helin, LIMMS/CNRS-Univ. of Tokyo (Japan)
Hiroyuki Fujita, Univ. of Tokyo (Japan)

Published in SPIE Proceedings Vol. 3893:
Design, Characterization, and Packaging for MEMS and Microelectronics
Bernard Courtois; Serge N. Demidenko, Editor(s)

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