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Proceedings Paper

MTI focal plane assembly design and performance
Author(s): Jeffrey L. Rienstra; Mary Ballard
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Paper Abstract

The focal plane assembly for the Multispectral Thermal Imager (MTI) consists of sensor chip assemblies, optical filters, and a vacuum enclosure. Sensor chip assemblies, composed of linear detector arrays and readout integrated circuits, provide spatial resolution in the cross-track direction for the pushbroom imager. Optical filters define 15 spectral bands in a range from 0.45 micrometer to 10.7 micrometer. All the detector arrays are mounted on a single focal plane and are designed to operate at 75 K. Three pairs of sensor chip assemblies (SCAs) are required to provide cross-track coverage in all 15 spectral bands. Each pair of SCAs includes detector arrays made from silicon, indium antimonide, and mercury cadmium telluride. Readout integrated circuits multiplex the signals from the detectors to 18 separate video channels. Optical filter assemblies defining the spectral bands are mounted over the linear detector arrays. Each filter assembly consists of several filter strips bonded together side-by- side. The MTI focal plane assembly has been integrated with the rest of the payload and has undergone detailed testing and calibration. This paper includes representative test data for the various spectral bands and the overall performance of the focal plane assembly.

Paper Details

Date Published: 27 October 1999
PDF: 11 pages
Proc. SPIE 3753, Imaging Spectrometry V, (27 October 1999); doi: 10.1117/12.366299
Show Author Affiliations
Jeffrey L. Rienstra, Sandia National Labs. (United States)
Mary Ballard, Raytheon Infrared Ctr. of Excellence (United States)


Published in SPIE Proceedings Vol. 3753:
Imaging Spectrometry V
Michael R. Descour; Sylvia S. Shen, Editor(s)

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