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Proceedings Paper

Measurement of deformation of solder joint during heating with speckle interferometry
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Paper Abstract

The heat expansion of the solder joint on a PCB board has been investigated using speckle interferometry. Set-ups for measuring in-plane and out-of-plane displacements have been separately used. The component was stepwise heated by increasing the working current. During the heating the temperature was measured by a thermocouple. For each step, the heating was halted until thermal equilibrium occurred, then four phase-shifted interferograms were recorded for each temperature Tn. In this way the deformation between two temperatures Tn+1 and Tn were evaluated. The deformation was measured in different directions and the joint solder's strains were calculated.

Paper Details

Date Published: 13 October 1999
PDF: 7 pages
Proc. SPIE 3783, Optical Diagnostics for Fluids/Heat/Combustion and Photomechanics for Solids, (13 October 1999); doi: 10.1117/12.365759
Show Author Affiliations
Wei An, Royal Institute of Technology (Sweden)
Torgny E. Carlsson, Royal Institute of Technology (Sweden)


Published in SPIE Proceedings Vol. 3783:
Optical Diagnostics for Fluids/Heat/Combustion and Photomechanics for Solids
Soyoung Stephen Cha; Peter John Bryanston-Cross; Carolyn R. Mercer, Editor(s)

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