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Proceedings Paper

Development of silicon microcapacitive accelerometer for seismic measurement
Author(s): Mitsutomo Nishizawa; Geunbae Lim; Hiroaki Niitsuma; Masayoshi Esashi
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Paper Abstract

We have developed a high sensitive and wide-band micro capacitive accelerometer for subsurface seismic measurements by using the micro machining technique which enables to fabricate three-dimensional micro structure and to realize small-size, low-cost and high performance sensors or actuators. The silicon capacitive micro accelerometers, which are used in automobiles for suspension control, brake control and air bags, are potentially be used for subsurface seismic measurements. However the sensitivity and the bandwidth of existing sensors are insufficient to detect seismic waves. The micromachining technique which we employed includes photolithography, anisotropic etching, reactive ion etching and anodic bonding. Problems in the fabrication process such as sticking of silicon mass on the electrode, buckling of spring beams, and a problem due to the squeezed film dumping effect have been resolved by improving the sensor structure and the silicon process. Finally, we have evaluated the characteristics of the sensor.

Paper Details

Date Published: 15 October 1999
PDF: 8 pages
Proc. SPIE 3752, Subsurface Sensors and Applications, (15 October 1999); doi: 10.1117/12.365691
Show Author Affiliations
Mitsutomo Nishizawa, Tohoku Univ. (Japan)
Geunbae Lim, Samsung Advanced Institute of Technology (South Korea)
Hiroaki Niitsuma, Tohoku Univ. (Japan)
Masayoshi Esashi, Tohoku Univ. (Japan)

Published in SPIE Proceedings Vol. 3752:
Subsurface Sensors and Applications
Cam Nguyen, Editor(s)

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