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Proceedings Paper

3D micromachined devices based on polyimide joint technology
Author(s): Thorbjoern Ebefors; Johan Ulfstedt-Mattsson; Edvard Kaelvesten; Goeran Stemme
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Paper Abstract

A novel and simple technology for making robust 3D silicon structures with small radii of bending has been developed and investigated. The proposed self-assembling method of bending 3D structure out-of-plane, without the use of interlocking braces is based on thermal shrinkage of polyimide in V-grooves. The static bending angle for the permanent out-of-plane rotated structure can be chosen and well controlled over a wide range by varying the curing temperature of the polyimide and the number of V-grooves in the joint.

Paper Details

Date Published: 1 October 1999
PDF: 15 pages
Proc. SPIE 3892, Device and Process Technologies for MEMS and Microelectronics, (1 October 1999); doi: 10.1117/12.364509
Show Author Affiliations
Thorbjoern Ebefors, Royal Institute of Technology (Sweden)
Johan Ulfstedt-Mattsson, Royal Institute of Technology (Sweden)
Edvard Kaelvesten, Royal Institute of Technology (Sweden)
Goeran Stemme, Royal Institute of Technology (Sweden)


Published in SPIE Proceedings Vol. 3892:
Device and Process Technologies for MEMS and Microelectronics
Kevin H. Chau; Sima Dimitrijev, Editor(s)

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