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Proceedings Paper

Fabrication of high-yield Si microdiaphragms using electrochemical etch stop in TMAH/IPA/pyrazine solution
Author(s): Gwiy-Sang Chung; Chin-Sung Park; Byeong-Kwon Ju
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Paper Abstract

This paper presents the fabrication of high-yield Si micro- diaphragms using electrochemical etch-stop method in TMAH/IPA/pyrazine solution. When IPA was added TMAH solution, the flatness of etching front is improved and undercutting is reduced, but the etch rate of (100) Si is decreased. The (100) Si etch rate is improved with addition of pyrazine. The (100) Si etch rate of 0.8/min which is faster by 13 percent than pure TMAH 20 wt percent solution is obtained using TMAH 20 wt percent/pyrazine 0.5 g and the etch rate of (100) Si is decreased with more additive quantity of pyrazine. Addition of pyrazine to TMAH 25 wt percent solution, the flatness variations of etching front is not observed and undercutting ratio is reduced about 30- 50 percent. Addition of pyrazine to TMAH increases the etch ratio f(100) Si, thus the elapsed time for etch-stop was shortened. I-V curves of n- and p-type Si in TMAH/IPA/pyrazine solution were obtained. OCP and PP of n- and p-type Si were also obtained, and applied potential was selected between n- and p-type Si's PP. 801 Si micro- diaphragms having 20 thick were fabricated on 5 inch Si wafer using electrochemical etch-stop method in TMAH/IPA/pyrazine solution. The average thicknesses of micro-diaphragms were 20.03 and standard deviation was +/- 0.26.

Paper Details

Date Published: 1 October 1999
PDF: 10 pages
Proc. SPIE 3892, Device and Process Technologies for MEMS and Microelectronics, (1 October 1999); doi: 10.1117/12.364502
Show Author Affiliations
Gwiy-Sang Chung, Dongseo Univ. (South Korea)
Chin-Sung Park, Dongseo Univ. (South Korea)
Byeong-Kwon Ju, Korea Institute of Science and Technology (South Korea)


Published in SPIE Proceedings Vol. 3892:
Device and Process Technologies for MEMS and Microelectronics
Kevin H. Chau; Sima Dimitrijev, Editor(s)

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