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Proceedings Paper

Micromachined accelerometer based on electron tunneling
Author(s): Yongjun Yang; Lijie Li; Yongqing Xu; Yanjun Zhao; Chun-Guang Liang; Tongli Wei
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Paper Abstract

In this paper, a new micromachined tunneling accelerometer is described. Using the bulk-silicon fabrication technology and the silicon/glass electrostatic bonding process, a sandwich structure tunneling accelerometer has been fabricated and tested. In order to reduce the low frequency noise, the feedback circuit has been improved by adding oscillator and demodulator. The first prototype has a resolution of approximately 1e-6g/ (root) Hz and can survive with at least 50g shocking.

Paper Details

Date Published: 29 September 1999
PDF: 5 pages
Proc. SPIE 3891, Electronics and Structures for MEMS, (29 September 1999); doi: 10.1117/12.364473
Show Author Affiliations
Yongjun Yang, Southeast Univ. (China)
Lijie Li, Hebei Semiconductor Research Institute (United Kingdom)
Yongqing Xu, Hebei Semiconductor Research Institute (China)
Yanjun Zhao, Hebei Semiconductor Research Institute (China)
Chun-Guang Liang, Hebei Semiconductor Research Institute (China)
Tongli Wei, Southeast Univ. (China)


Published in SPIE Proceedings Vol. 3891:
Electronics and Structures for MEMS
Neil W. Bergmann; Olaf Reinhold; Norman C. Tien, Editor(s)

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