Share Email Print
cover

Proceedings Paper

Flip-chip process development using recessed bonding pads for laser/MEMS integration
Author(s): Michel A. Rosa; Decai Sun
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

This paper presents and discusses experimental results which successfully demonstrate using flip-chip techniques, the bonding and operation of a GaAs edge emitting laser on a silicon substrate having recessed bonding pads. The flip chip alignment and bonding technique is discussed first, focusing on experimental results for both flux and flux-less forms of solder bump processing, the developed flux-less technique is shown to provide comparable solder bump integrity and yield. Subsequent to the newly developed solder bump fabrication methodology shown, a recessed bonding pad design is introduced and demonstrated experimentally to aid in the final coarse alignment and assembly of the GaAs laser device onto a silicon substrate. Together both the flux-less solder bump and bonding pad recess design and fabrication processes provide increased reliability for integration with MEMS and MOEMS based devices and systems over traditional methods for hybrid device attachment.

Paper Details

Date Published: 29 September 1999
PDF: 11 pages
Proc. SPIE 3891, Electronics and Structures for MEMS, (29 September 1999); doi: 10.1117/12.364472
Show Author Affiliations
Michel A. Rosa, Xerox Palo Alto Research Ctr. (United States)
Decai Sun, Xerox Palo Alto Research Ctr. (United States)


Published in SPIE Proceedings Vol. 3891:
Electronics and Structures for MEMS
Neil W. Bergmann; Olaf Reinhold; Norman C. Tien, Editor(s)

© SPIE. Terms of Use
Back to Top