Share Email Print
cover

Proceedings Paper

Surface-micromachined electrostatic diaphragm micropump
Author(s): Won-Ick Jang; Yong Il Lee; Chang-Auck Choi; Chi-Hoon Jun; Youn Tae Kim
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

An electrostatic diaphragm micropump for fluids and gases has been designed and fabricated by silicon surface micromachining. Diaphragm structures are bridge-type, cantilever-type and fan-type polysilicon, and sacrificial layers are low-temperatures oxide on polysilicon substrates. The developed anhydrous HF gas-phase etching of sacrificial oxide on polysilicon substrates has been employed to release polysilicon microstructures. The fabricated micropump with size of the order of 1 mm2 operates at square wave voltage of 10V and 2Hz under near room temperature and normal atmospheric pressure.

Paper Details

Date Published: 29 September 1999
PDF: 8 pages
Proc. SPIE 3891, Electronics and Structures for MEMS, (29 September 1999); doi: 10.1117/12.364469
Show Author Affiliations
Won-Ick Jang, Electronics and Telecommunications Research Institute (South Korea)
Yong Il Lee, Electronics and Telecommunications Research Institute (South Korea)
Chang-Auck Choi, Electronics and Telecommunications Research Institute (South Korea)
Chi-Hoon Jun, Electronics and Telecommunications Research Institute (South Korea)
Youn Tae Kim, Electronics and Telecommunications Research Institute (South Korea)


Published in SPIE Proceedings Vol. 3891:
Electronics and Structures for MEMS
Neil W. Bergmann; Olaf Reinhold; Norman C. Tien, Editor(s)

© SPIE. Terms of Use
Back to Top