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Proceedings Paper

Surface-micromachined electrostatic diaphragm micropump
Author(s): Won-Ick Jang; Yong Il Lee; Chang-Auck Choi; Chi-Hoon Jun; Youn Tae Kim
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Paper Abstract

An electrostatic diaphragm micropump for fluids and gases has been designed and fabricated by silicon surface micromachining. Diaphragm structures are bridge-type, cantilever-type and fan-type polysilicon, and sacrificial layers are low-temperatures oxide on polysilicon substrates. The developed anhydrous HF gas-phase etching of sacrificial oxide on polysilicon substrates has been employed to release polysilicon microstructures. The fabricated micropump with size of the order of 1 mm2 operates at square wave voltage of 10V and 2Hz under near room temperature and normal atmospheric pressure.

Paper Details

Date Published: 29 September 1999
PDF: 8 pages
Proc. SPIE 3891, Electronics and Structures for MEMS, (29 September 1999); doi: 10.1117/12.364469
Show Author Affiliations
Won-Ick Jang, Electronics and Telecommunications Research Institute (South Korea)
Yong Il Lee, Electronics and Telecommunications Research Institute (South Korea)
Chang-Auck Choi, Electronics and Telecommunications Research Institute (South Korea)
Chi-Hoon Jun, Electronics and Telecommunications Research Institute (South Korea)
Youn Tae Kim, Electronics and Telecommunications Research Institute (South Korea)


Published in SPIE Proceedings Vol. 3891:
Electronics and Structures for MEMS
Neil W. Bergmann; Olaf Reinhold; Norman C. Tien, Editor(s)

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