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Proceedings Paper

Comparative analysis of silicon wafer micromachining versus nonconventional technology
Author(s): Dumitru Gh. Ulieru
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Paper Abstract

In very large scale of integration processing photolithographic techniques control the patterning of thin film and the deposition of dopant used to make transistor gates and metal contacts. Microelectromechanical systems (MEMS) processing uses the same techniques to create structural components that are essentially submillimeter- sized machines parts. These parts usually require post- fabrication processing or assembly in order to become finished devices. MEMS technology can generally be categorized into two groups as bulk and surface micromachining. These categories respect not only different fabrication processes but different post fabrication techniques for finishing the mechanical subsystem.

Paper Details

Date Published: 20 September 1999
PDF: 7 pages
Proc. SPIE 3822, Computer-Controlled Microshaping, (20 September 1999); doi: 10.1117/12.364215
Show Author Affiliations
Dumitru Gh. Ulieru, Romes SA (Romania)

Published in SPIE Proceedings Vol. 3822:
Computer-Controlled Microshaping
Vadim P. Veiko; Tamas Szoerenyi, Editor(s)

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