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Proceedings Paper

High-aspect-ratio microdrilling in polymeric materials with intense KrF laser radiation
Author(s): John Lopez; Sylvain Lazare; Francois Weisbuch
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Paper Abstract

UV laser microdrilling of high aspect ratio holes requires a low numerical aperture and intense beam. It does not produce any thermal or mechanical damage on the target. In some particular experimental conditions, it is shown that long deep holes are obtained with reproducible aspect ratio ((Phi) /d approximately equals 600) in a variety of materials. Generally speaking the more absorbing the polymer is, the better is the resolution. However highly absorbing materials exhibit a low ablation rate. These promising results on laser microdrilling can be extended to new applications when beam and target relative movement is computer driven. For instance this approach can applied to cutting micro-objects with complicated shape or machining of fragile or brittle materials.

Paper Details

Date Published: 20 September 1999
PDF: 6 pages
Proc. SPIE 3822, Computer-Controlled Microshaping, (20 September 1999); doi: 10.1117/12.364214
Show Author Affiliations
John Lopez, Univ. de Bordeaux I (France)
Sylvain Lazare, Univ. de Bordeaux I (France)
Francois Weisbuch, Univ. de Bordeaux I (France)


Published in SPIE Proceedings Vol. 3822:
Computer-Controlled Microshaping
Vadim P. Veiko; Tamas Szoerenyi, Editor(s)

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