Share Email Print
cover

Proceedings Paper

Comparative study of the thermal properties of hybrid integrated VCSEL arrays
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

After successfully bonding VCSEL arrays to GaAs dummy chips and CMOS chips with three different bonding techniques, the thermal resistance and crosstalk of the bonded VCSEL arrays were measured. The thermal resistance of the VCSELs bonded to a GaAs substrate was found to be as low as 1100 K/W, indicating a high quality contact. Less than 100 K/W thermal crosstalk was also observed in the VCSEL arrays with a pitch of 250 micrometers . The thermal resistance of the VCSEL bonded to a CMOS chip with a standard bonding pad design has also been measured, which is 2490 K/W. The high thermal resistance is due to the dielectric layers underneath the bonding pads.

Paper Details

Date Published: 1 October 1999
PDF: 11 pages
Proc. SPIE 3805, Photonic Devices and Algorithms for Computing, (1 October 1999); doi: 10.1117/12.363983
Show Author Affiliations
Rui Pu, Colorado State Univ. (United States)
Carl W. Wilmsen, Colorado State Univ. (United States)
Kent D. Choquette, Sandia National Labs. (United States)
Kent M. Geib, Sandia National Labs. (United States)


Published in SPIE Proceedings Vol. 3805:
Photonic Devices and Algorithms for Computing
Khan M. Iftekharuddin; Abdul Ahad Sami Awwal, Editor(s)

© SPIE. Terms of Use
Back to Top