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Proceedings Paper

New metrology stage for ion projection lithography made of glass ceramics
Author(s): Stefan Risse; Thomas Peschel; Christoph Damm; Ulf Carsten Kirschstein
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Paper Abstract

In the next few years a new chip-generation with structure sizes well below 100 nm and high complexity will require novel, so-called 'future lithography' processes. One of these new technologies is the Ion Projection Lithography. Within the framework of a large European project lead by SIEMENS, the necessary technologies are developed and the first pilot system will be built. In this system, one of the most important units is a high precision wafer stage. The heart of the stage system is the so-called metrology - plate with integrated electrostatic wafer chuck and handling unit. The design of this novel stage system is described in this contribution. Extensive FEM-simulations from the basis of the present design. All major components are made from glass-ceramics to guarantee the highest possible thermal and mechanical stability. Not only in the field of lithography many modern precision mechanical systems require position tolerances in the sub-micrometer and seconds of arc range. Strong systems solutions can be developed by the effort of glass-ceramics and new and traditional manufacturing processes.

Paper Details

Date Published: 28 September 1999
PDF: 9 pages
Proc. SPIE 3786, Optomechanical Engineering and Vibration Control, (28 September 1999); doi: 10.1117/12.363812
Show Author Affiliations
Stefan Risse, Fraunhofer-Institut fuer Angewandte Optik und Feinmechanik (Germany)
Thomas Peschel, Fraunhofer-Institut fuer Angewandte Optik und Feinmechanik (Germany)
Christoph Damm, Fraunhofer-Institut fuer Angewandte Optik und Feinmechanik (Germany)
Ulf Carsten Kirschstein, Leica Microsystems Lithography GmbH (Germany)

Published in SPIE Proceedings Vol. 3786:
Optomechanical Engineering and Vibration Control
Eddy A. Derby; Eddy A. Derby; Colin G. Gordon; Colin G. Gordon; Daniel Vukobratovich; Carl H. Zweben; Daniel Vukobratovich; Paul R. Yoder; Carl H. Zweben, Editor(s)

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