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Proceedings Paper

Innovative integrated plasma tool for process and exhaust monitoring
Author(s): Eric Chevalier; Philippe Maquin
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Paper Abstract

Vacuum-level problems in semiconductor process tools -- from leaks or contamination -- can significantly reduce product yield and tool availability if not detected quickly. Here we present a portable and compact plasma sensor which can monitor the fingerprint of effluent from the process chamber to the exhaust piping by optical emission spectroscopy. The device and tests to monitor and control semiconductor process are described. Further applications such as effluent treatment are tackled.

Paper Details

Date Published: 27 August 1999
PDF: 8 pages
Proc. SPIE 3884, In-Line Methods and Monitors for Process and Yield Improvement, (27 August 1999); doi: 10.1117/12.361362
Show Author Affiliations
Eric Chevalier, Alcatel (Switzerland)
Philippe Maquin, Alcatel (France)


Published in SPIE Proceedings Vol. 3884:
In-Line Methods and Monitors for Process and Yield Improvement
Sergio A. Ajuria; Jerome F. Jakubczak, Editor(s)

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