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Proceedings Paper

Failure analysis of wafer-level reliability testing failure
Author(s): Chong Khiam Oh; Soh Ping Neo; Jian Hua Bi; Zong Min Wu; Lian Choo Goh; Shailesh Redkar
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Paper Abstract

Wafer-level reliability (WLR) testing is an important tool that is used during the productization phase to investigate the reliability performance of devices and materials before full qualification cycle. The rapid nature of the WLR testing permits the process engineer to evaluate process variation and to obtain almost instantaneous feedback about its reliability impact. Fast reliability feedback is essential to help the process engineer build reliability into our product during the productization phase. Understand the root cause and failure mechanism after WLR testing, failure analysis plays a very important role. This paper describes the fundamental requirements for failure analysis equipment needed, the failure analysis and preparatory techniques used to locate the failure sites and cases study will be presented.

Paper Details

Date Published: 27 August 1999
PDF: 8 pages
Proc. SPIE 3884, In-Line Methods and Monitors for Process and Yield Improvement, (27 August 1999); doi: 10.1117/12.361354
Show Author Affiliations
Chong Khiam Oh, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Soh Ping Neo, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Jian Hua Bi, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Zong Min Wu, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Lian Choo Goh, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Shailesh Redkar, Chartered Semiconductor Manufacturing Ltd. (Singapore)


Published in SPIE Proceedings Vol. 3884:
In-Line Methods and Monitors for Process and Yield Improvement
Sergio A. Ajuria; Jerome F. Jakubczak, Editor(s)

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