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Proceedings Paper

Particle issues in spin-on dielectric materials
Author(s): Thomas R. Washer
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Paper Abstract

Particles are transferred to wafer surfaces during application of spin-on dielectrics (SOD). Excessive particle levels on wafers are known to reduce device yield. Separate instruments using laser-light scattering techniques are used to assess liquid-born particles in SOD precursors and particles transferred to wafer surfaces in SOD processes. Experiment shows that, based on the particle concentration in the liquid, the number of liquid-borne particles dispensed onto the wafer is significantly larger than the number of particles measured on the wafer after SOD deposition. In experiments the obvious correlations expected between liquid-borne particle concentrations and wafer particle counts were not observed for the magnitude of liquid-borne particle concentrations commonly associated with modern VLSI device production. Two models are proposed to explain these observations. The models estimate the liquid-to-wafer particle transfer based on the liquid- borne particle concentration and the solids transferred either as a percent of total solids or as a percent of total volume. The models estimate that the number of particles transferred from even relatively high particle count spin-on dielectric liquid precursors challenge the measurement sensitivity/capability of the wafer surface scanning inspection station.

Paper Details

Date Published: 27 August 1999
PDF: 11 pages
Proc. SPIE 3884, In-Line Methods and Monitors for Process and Yield Improvement, (27 August 1999); doi: 10.1117/12.361337
Show Author Affiliations
Thomas R. Washer, Dow Corning Corp. (United States)


Published in SPIE Proceedings Vol. 3884:
In-Line Methods and Monitors for Process and Yield Improvement
Sergio A. Ajuria; Jerome F. Jakubczak, Editor(s)

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