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Proceedings Paper

In-line monitoring of chemical-mechanical polishing processes
Author(s): Dale L. Hetherington; David J. Stein
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Paper Abstract

We present an overview of in-line monitoring of chemical- mechanical polishing (CMP) processes. We discuss the technical challenges and review many of the approaches that have been published. Several methods are currently under investigation including optical, thermal (pad temperature), friction (torque motor current), electrochemical, and acoustic (vibration).

Paper Details

Date Published: 27 August 1999
PDF: 12 pages
Proc. SPIE 3884, In-Line Methods and Monitors for Process and Yield Improvement, (27 August 1999); doi: 10.1117/12.361329
Show Author Affiliations
Dale L. Hetherington, Sandia National Labs. (United States)
David J. Stein, Sandia National Labs. (United States)


Published in SPIE Proceedings Vol. 3884:
In-Line Methods and Monitors for Process and Yield Improvement
Sergio A. Ajuria; Jerome F. Jakubczak, Editor(s)

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