Share Email Print
cover

Proceedings Paper

AMD's advanced process control of poly-gate critical dimension
Author(s): Anthony J. Toprac
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Formation of the MOS-FET polysilicon gate structure is a critical step in integrated circuit manufacturing. Control of poly-gate Critical Dimension (CD's) greatly affects revenue from microprocessor production. Poly-gate CD's correlate strongly to speed. As a result, variation in CD control causes unsaleable slow parts, high revenue fast parts, or scrapped high leakage product from overly fast parts. Controlling to the optimal value CD value, however, it is a difficult task due to the continual drift and step changes that occur in the photolithography and etch tools. As a result of this need, AMD's Fab 25 developed an automated run-to-run controller of poly-gate CD's as part of an Advanced Process Control (APC) initiative. From the perspective of both control and manufacturability, Fab 25's Run-to-Run controller of poly-gate Critical Dimension (CD) has been a critical enabler of our success in manufacturing the K6 product. This paper discusses the architecture, algorithm and results of the poly-gate CD control system.

Paper Details

Date Published: 3 September 1999
PDF: 4 pages
Proc. SPIE 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V, (3 September 1999); doi: 10.1117/12.361324
Show Author Affiliations
Anthony J. Toprac, Advanced Micro Devices, Inc. (United States)


Published in SPIE Proceedings Vol. 3882:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V
Anthony J. Toprac; Kim Dang, Editor(s)

© SPIE. Terms of Use
Back to Top