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Proceedings Paper

Integration of the APC framework with AMD's Fab25 factory system
Author(s): Scott Bushman; William Jarrett Campbell; Michael L. Miller
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Paper Abstract

This paper discusses the integration and development of advanced process control technologies with AMD's Fab25 factory systems using the Advance Process Control Framework. The Framework is an open software architecture that allows the integration of existing factory systems, such as the manufacturing execution systems, configurable equipment interfaces, recipe management systems, metrology tools, process tools, and add-on sensors, into a system which provides advanced process control specific functionality. The Advanced Process Control Framework project was formulated to enable effective integration of Advanced Process Control applications into a semiconductor facility to improve manufacturing productivity and product yields. The main communication link between the factory system and the Framework is the Configurable Equipment Interface. It interfaces through a specialized component in the framework, the Machine Interface, which converts the factory system communication protocol, ISIS, to the Framework protocol, CORBA. The Framework is a distributed architecture that uses CORBA as a communication protocol between specialized components. A generalized example of how the Framework is integrated into the semiconductor facility is provided, as well as a description of the overall architecture used for process control strategy development. The main development language, Tcl/Tk, provides for increased development and deployment over traditional coding methods.

Paper Details

Date Published: 3 September 1999
PDF: 7 pages
Proc. SPIE 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V, (3 September 1999); doi: 10.1117/12.361323
Show Author Affiliations
Scott Bushman, Advanced Micro Devices, Inc. (United States)
William Jarrett Campbell, Advanced Micro Devices, Inc. (United States)
Michael L. Miller, Advanced Micro Devices, Inc. (United States)


Published in SPIE Proceedings Vol. 3882:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V
Anthony J. Toprac; Kim Dang, Editor(s)

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