Share Email Print

Proceedings Paper

Approaches to solving tool corrosion problems through process modification
Author(s): Shirley Ekbundit; Judith B. Barker; Yeo-Hwan Yang; Brian Izzio
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The presence of HCl during low temperature (790 degrees Celsius - 850 degrees Celsius) wet oxidation process has been shown to cause severe tool corrosion in vertical furnaces. Two types of particulates were observed: white film deposited inside and outside the loading station and metal corrosion at the process door. Although the origin of the white film has not been identified, both types of particles are found to have a direct relationship to the condensed liquid produced during the process. In this study, we evaluated the corrosion causing process and have made modifications to the process as an attempt to resolve the corrosion problem. Three new processes were developed using the same oxidation temperature as the standard HCl/wet oxidation: (1) non-HCl wet oxidation, (2) non-HCl wet oxidation followed by post-oxidation anneal at higher temperature and (3) HCl wet oxidation and high temperature post-oxidation anneal. The anneal step was added as a way to remove acidic condensation. In order to ensure the integrity of MOS devices due to process changes, the end-of- line parameters (Yield, Vt shift and QBD) were evaluated. Parametric data showed that the changes do not significantly impact the gate oxide integrity.

Paper Details

Date Published: 3 September 1999
PDF: 4 pages
Proc. SPIE 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V, (3 September 1999); doi: 10.1117/12.361303
Show Author Affiliations
Shirley Ekbundit, Motorola (United States)
Judith B. Barker, Motorola (United States)
Yeo-Hwan Yang, Motorola (United States)
Brian Izzio, Motorola (United States)

Published in SPIE Proceedings Vol. 3882:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V
Anthony J. Toprac; Kim Dang, Editor(s)

© SPIE. Terms of Use
Back to Top