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Proceedings Paper

Characterization of the CMP process by atomic force profilometry
Author(s): Larry M. Ge; Dean J. Dawson
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Paper Abstract

We demonstrate the measurement capabilities of the newly developed Atomic Force Profiler (AFP) as a CMP process metrology tool. AFP combines a TappingMode atomic force microscopy (AFM) with a long scan profiler stage and can be used to characterize post-CMP local and global planarization for current and future generations of device manufacturing. The AFP enables CMP measurements of dishing, erosion, plug recess, and surface texture, providing adequate lateral resolution to image individual deep sub-micron device features as well as capability to profile long scans across multiple dies. In this paper we demonstrate that AFP can be used for the process development and production monitoring of metal CMP. Automated measurement of deep sub-micron W plug recess/protrusion, damascene Cu lines recess/protrusion, as well as erosion due to W or Cu structures is presented.

Paper Details

Date Published: 3 September 1999
PDF: 6 pages
Proc. SPIE 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V, (3 September 1999); doi: 10.1117/12.361298
Show Author Affiliations
Larry M. Ge, Digital Instruments/Veeco Metrology Group (United States)
Dean J. Dawson, Digital Instruments/Veeco Metrology Group (United States)


Published in SPIE Proceedings Vol. 3882:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V
Anthony J. Toprac; Kim Dang, Editor(s)

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