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Proceedings Paper

Application of CD-SEM edge-width measurement to contact-hole process monitoring and development
Author(s): Jean Y. M. Yang; Ian M. Dudley
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Paper Abstract

In this paper, we describe the application of the edge width measurement to the monitoring of contact hole openings in an attempt to evaluate its ultimate limitations due to tool resolution, measurement algorithm, and process sensitivity. Substantial variations in the top-down SEM image and waveform translated to smaller but still detectable variations in measured edge width using a max slope/linear regression algorithm. The images and waveforms indicate the top-down SEM resolution to be sufficient to detect process variations, but the measured results suggest optimization of the algorithms for this specific purpose will be necessary.

Paper Details

Date Published: 3 September 1999
PDF: 8 pages
Proc. SPIE 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V, (3 September 1999); doi: 10.1117/12.361297
Show Author Affiliations
Jean Y. M. Yang, Advanced Micro Devices, Inc. (United States)
Ian M. Dudley, Advanced Micro Devices, Inc. (United States)


Published in SPIE Proceedings Vol. 3882:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V
Anthony J. Toprac; Kim Dang, Editor(s)

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