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Proceedings Paper

Micromirror arrays fabricated by flip-chip assembly
Author(s): M. Adrian Michalicek; Wenge Zhang; Kevin F. Harsh; Victor M. Bright; Y. C. Lee
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Paper Abstract

This paper presents the design, fabrication, modeling, and testing of several Flexure-Beam Micromirror Device (FBMD) arrays fabricated using flip-chip assembly. These arrays were prefabricated using a silicon surface-micromachining technology and then transferred to a ceramic receiving substrate using a thin layer of indium placed between the bond pads of the two chips. Device characterization was completed using an interferometric microscope in which micromirror deflection was determined as a function of address potential. The arrays demonstrate reasonable micromirror performance with optically flat surfaces measuring only 5 - 6 nm of variance across as much as a 150 micrometer mirror surface.

Paper Details

Date Published: 2 September 1999
PDF: 12 pages
Proc. SPIE 3878, Miniaturized Systems with Micro-Optics and MEMS, (2 September 1999); doi: 10.1117/12.361291
Show Author Affiliations
M. Adrian Michalicek, Univ. of Colorado/Boulder (United States)
Wenge Zhang, Univ. of Colorado/Boulder (United States)
Kevin F. Harsh, Univ. of Colorado/Boulder (United States)
Victor M. Bright, Univ. of Colorado/Boulder (United States)
Y. C. Lee, Univ. of Colorado/Boulder (United States)

Published in SPIE Proceedings Vol. 3878:
Miniaturized Systems with Micro-Optics and MEMS
M. Edward Motamedi; Rolf Goering, Editor(s)

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