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Proceedings Paper

Low-temperature approaches for fabrication of high-frequency microscanners
Author(s): Karla Hiller; Ramon Hahn; Christian Kaufmann; Steffen Kurth; Kersten Kehr; Thomas Gessner; Wolfram Doetzel; M. Wiemer; I. Schubert
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Paper Abstract

Within this paper novel applications of low temperature silicon wafer bonding technologies for the fabrication of high frequency silicon microscanners are presented. Two technological approaches are discussed, both using low temperature bonding as a key technological step. Results of the integration of a special low temperature bonding process within the bulk technology approach are shown. Micromirror arrays fabricated with this technology are presented and show promising results for optical applications.

Paper Details

Date Published: 2 September 1999
PDF: 9 pages
Proc. SPIE 3878, Miniaturized Systems with Micro-Optics and MEMS, (2 September 1999); doi: 10.1117/12.361290
Show Author Affiliations
Karla Hiller, Chemnitz Univ. of Technology (Germany)
Ramon Hahn, Chemnitz Univ. of Technology (Germany)
Christian Kaufmann, Chemnitz Univ. of Technology (Germany)
Steffen Kurth, Chemnitz Univ. of Technology (Germany)
Kersten Kehr, Chemnitz Univ. of Technology (Germany)
Thomas Gessner, Chemnitz Univ. of Technology (Germany)
Wolfram Doetzel, Chemnitz Univ. of Technology (Germany)
M. Wiemer, Fraunhofer Institute of Reliability and Microintegration (Germany)
I. Schubert, LDT GmbH & Co. (Germany)

Published in SPIE Proceedings Vol. 3878:
Miniaturized Systems with Micro-Optics and MEMS
M. Edward Motamedi; Rolf Goering, Editor(s)

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