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Proceedings Paper

Thick photoresist imaging using a three-wavelength exposure stepper
Author(s): Bradley Todd; Warren W. Flack; Sylvia White
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Paper Abstract

Images formed in thick photosensitive materials are widely used as electroplating molds for micro-electromechanical (MEMS) part and other electronic applications such as bump bonding, thin film heads and multichip module manufacturing. The expansion of traditional microelectronic lithography into very thick photoresists present a technical challenge for stepper manufacturers that have traditionally attempted to optimize resolution and depth of focus for thin photoresist systems. Stepper optics and illumination needs to be re-optimized for the best performance in thick photosensitive materials.

Paper Details

Date Published: 30 August 1999
PDF: 15 pages
Proc. SPIE 3874, Micromachining and Microfabrication Process Technology V, (30 August 1999); doi: 10.1117/12.361238
Show Author Affiliations
Bradley Todd, Ultratech Stepper, Inc. (United States)
Warren W. Flack, Ultratech Stepper, Inc. (United States)
Sylvia White, Ultratech Stepper, Inc. (United States)


Published in SPIE Proceedings Vol. 3874:
Micromachining and Microfabrication Process Technology V
James H. Smith; Jean Michel Karam, Editor(s)

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