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Proceedings Paper

Laser welding: providing alignment precision and accuracy to substrate-level packaging
Author(s): Joe Brown; Nikolaus Maier; Kim Y. Lee; Lorenz Ziegltrum; Jim St Leger
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Paper Abstract

As Micro Systems Technology (MST) expands into new product applications, the present system used to align substrates will have significant impact on yield and product performance. A new technique that ensures the best possible alignment has been developed eliminating misalignment effects from temperature, shock and mechanical movement. This new approach called Laser Welding maintains the precision alignment advantage of setting or freezing substrate position using laser technology to form micro bond spots while the substrates are in the alignment system. The transport tooling is no longer required to maintain alignment with mechanical clamping. This technique will allow device and process designers to scale the requirements for aligned substrate bonding to new levels. At the same time it will dramatically reduce the risk of misalignment from the present transport tooling associated with processes that are at the end of a cumulative build.

Paper Details

Date Published: 30 August 1999
PDF: 7 pages
Proc. SPIE 3874, Micromachining and Microfabrication Process Technology V, (30 August 1999); doi: 10.1117/12.361217
Show Author Affiliations
Joe Brown, Karl Suss America (United States)
Nikolaus Maier, Karl Suss KG GmbH & Co. (Germany)
Kim Y. Lee, Etec Systems, Inc. (United States)
Lorenz Ziegltrum, Karl Suss KG GmbH & Co. (Germany)
Jim St Leger, Karl Suss America (United States)


Published in SPIE Proceedings Vol. 3874:
Micromachining and Microfabrication Process Technology V
James H. Smith; Jean Michel Karam, Editor(s)

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