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Proceedings Paper

Material-related effects on wet chemical micromachining of smart MEMS devices
Author(s): Aylin Hein; Stefan Finkbeiner; Jiri Marek; Ernst Obermeier
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Paper Abstract

Smart MEMS devices such as pressure, mass flow and yaw rate sensors are presented in detail. One common point of this range of devices is their fabrication technology regarding anisotropic etching. This paper is first meant to give a short review upon the applications processed by using wet chemical etching in KOH-solutions. Furthermore, we will discuss about the impact of material and process related defects in the silicon crystal and on the anisotropic etching behavior.

Paper Details

Date Published: 31 August 1999
PDF: 8 pages
Proc. SPIE 3876, Micromachined Devices and Components V, (31 August 1999); doi: 10.1117/12.360492
Show Author Affiliations
Aylin Hein, Robert Bosch GmbH (Germany)
Stefan Finkbeiner, Robert Bosch GmbH (Germany)
Jiri Marek, Robert Bosch GmbH (Germany)
Ernst Obermeier, Technical Univ. of Berlin (Germany)


Published in SPIE Proceedings Vol. 3876:
Micromachined Devices and Components V
Patrick J. French; Eric Peeters, Editor(s)

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