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Proceedings Paper

Fabrication of x-ray phase masks for sub-70-nm imaging
Author(s): Lei Yang; Yuli Vladimirsky; James Welch Taylor
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Paper Abstract

A more robust XPM with improved thermal and radiation stability was designed and fabricated in CNTech. The effectiveness of this design is demonstrated and XPM fabrication processing is optimized to obtain finer control over the processing, low stress membrane and vertical sidewall in the phase-shifter materials. The XPM testing indicates that this XPM design is able to readily generating sub-100 nm feature in large volume under a much larger and more manageable gap between mask and wafer (20 - 30 micrometers ). 70 nm lines were printed with UV 5 under 25 micrometers mask-to- wafer gap. The simplicity of this design and the intrinsic multiple mask reduction ratio instead of 1:1 for conventional X-ray mask provide an easy analytical tool for this community to study lithographic performance in 50-to-70 nm region.

Paper Details

Date Published: 3 September 1999
PDF: 8 pages
Proc. SPIE 3875, Materials and Device Characterization in Micromachining II, (3 September 1999); doi: 10.1117/12.360472
Show Author Affiliations
Lei Yang, Univ. of Wisconsin/Madison (United States)
Yuli Vladimirsky, Univ. of Wisconsin/Madison (United States)
James Welch Taylor, Univ. of Wisconsin/Madison (United States)


Published in SPIE Proceedings Vol. 3875:
Materials and Device Characterization in Micromachining II
Yuli Vladimirsky; Craig R. Friedrich, Editor(s)

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