Share Email Print
cover

Proceedings Paper

Relationship between internal stress and deformation of diaphragm at elevated temperatures using SEM
Author(s): Akira Yamashita; Yuichi Sakai; Tsukasa Matsuura; Kazuhiko Tsutsumi
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

This paper reports a study of the relationship between internal stress and deformation of diaphragm at elevated temperatures using scanning electron microscope. It is necessary to make a flat diaphragm in order to obtain good performance for various diaphragm-type sensors using heat transfer, such as flow sensors and accelerometers. When these sensors are used in high temperature environments, a flat diaphragm is required. Therefore, it is very important to observe and control the deformation behavior of a diaphragm at various temperatures. As far as we know, few results have been reported on the observation of deformed diaphragms at elevated temperatures.

Paper Details

Date Published: 3 September 1999
PDF: 8 pages
Proc. SPIE 3875, Materials and Device Characterization in Micromachining II, (3 September 1999); doi: 10.1117/12.360470
Show Author Affiliations
Akira Yamashita, Mitsubishi Electric Corp. (Japan)
Yuichi Sakai, Mitsubishi Electric Corp. (Japan)
Tsukasa Matsuura, Mitsubishi Electric Corp. (Japan)
Kazuhiko Tsutsumi, Mitsubishi Electric Corp. (Japan)


Published in SPIE Proceedings Vol. 3875:
Materials and Device Characterization in Micromachining II
Yuli Vladimirsky; Craig R. Friedrich, Editor(s)

© SPIE. Terms of Use
Back to Top