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Proceedings Paper

Small-area in-situ MEMS test structure to measure fracture strength by electrostatic probing
Author(s): Maarten P. de Boer; Brian D. Jensen; Fernando Bitsie
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Paper Abstract

We have designed, fabricated, tested and modeled a first generation small area test structure for MEMS fracture studies by electrostatic rather than mechanical probing. Because of its small area, this device has potential applications as a lot monitor of strength of fatigue of the MEMS structural material. By matching deflection versus applied voltage data to a 3D model of the test structure, we develop high confidence that the local stresses achieved in the gage section are greater than 1 GPa. Brittle failure of the polycrystalline silicon was observed.

Paper Details

Date Published: 3 September 1999
PDF: 7 pages
Proc. SPIE 3875, Materials and Device Characterization in Micromachining II, (3 September 1999); doi: 10.1117/12.360459
Show Author Affiliations
Maarten P. de Boer, Sandia National Labs. (United States)
Brian D. Jensen, Sandia National Labs. (United States)
Fernando Bitsie, Sandia National Labs. (United States)


Published in SPIE Proceedings Vol. 3875:
Materials and Device Characterization in Micromachining II
Yuli Vladimirsky; Craig R. Friedrich, Editor(s)

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