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Proceedings Paper

Automatic computer-aided system of simulating solder joint formation
Author(s): Xiujuan Zhao; Chunqing Wang; Guanqun Zheng; Gouzhong Wang; Shiqin Yang
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Paper Abstract

One critical aspect in electronic packaging is the fatigue/creep-induced failure in solder interconnections, which is found to be highly dependent on the shape of solder joints. Thus predicting and analyzing the solder joint shape is warranted. In this paper, an automatic computer-aided system is developed to simulate the formation of solder joint and analyze the influence of the different process parameters on the solder joint shape. The developed system is capable of visually designing the process parameters and calculating the solder joint shape automatically without any intervention from the user. The automation achieved will enable fast shape estimation with the variation of process parameters without time consuming experiments, and the simulating system provides the design and manufacturing engineers an efficient software tools to design soldering process in design environment. Moreover, a program developed from the system can serve as the preprocessor for subsequent finite element joint analysis program.

Paper Details

Date Published: 20 August 1999
PDF: 8 pages
Proc. SPIE 3833, Intelligent Systems in Design and Manufacturing II, (20 August 1999); doi: 10.1117/12.359507
Show Author Affiliations
Xiujuan Zhao, Harbin Institute of Technology (China)
Chunqing Wang, Harbin Institute of Technology (China)
Guanqun Zheng, Harbin Institute of Technology (China)
Gouzhong Wang, Shanghai Institute of Metallurgy (China)
Shiqin Yang, Harbin Institute of Technology (China)


Published in SPIE Proceedings Vol. 3833:
Intelligent Systems in Design and Manufacturing II
Bhaskaran Gopalakrishnan; San Murugesan, Editor(s)

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