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Proceedings Paper

Evaluation of micromechanical reliability of microactuator materials for hard-disk drive using the electrostatic test structure
Author(s): Se-Ho Lee; Yukeun Park; Dongil Kwon
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Paper Abstract

In micro-electromechanical system (MEMS) such as sensors and actuators, thin film has been widely used as microstructural materials. MEMS materials have differences with bulk in terms of mechanical reliability. So, the electrostatically actuated test structure is presented to measure the micromechanical reliability of micromaterials as thin films forming the microactuators. The designed test structures is fabricated by using the surface micromachining processes and driven by the electrostatic force. The sharp notch in the test structure is introduced by controlling the etching condition. The displacement, deflection and curvature of free standing beam in the electrostatic test structure under the electrostatic force is analyzed on the basis of the beam bending theory. From these results, we can predict the driving characteristics and the micromechanical reliability of microactuator materials under the operating condition.

Paper Details

Date Published: 18 August 1999
PDF: 8 pages
Proc. SPIE 3880, MEMS Reliability for Critical and Space Applications, (18 August 1999); doi: 10.1117/12.359372
Show Author Affiliations
Se-Ho Lee, Seoul National Univ. (South Korea)
Yukeun Park, Samsung Advanced Institute of Technology (South Korea)
Dongil Kwon, Seoul National Univ. (South Korea)


Published in SPIE Proceedings Vol. 3880:
MEMS Reliability for Critical and Space Applications
Russell A. Lawton; William M. Miller; Gisela Lin; Rajeshuni Ramesham, Editor(s)

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