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Proceedings Paper

Delamination study of chip-to-chip bonding for a LIGA-based safety and arming system
Author(s): Gowrishankar Subramanian; Michael Deeds; Kevin R. Cochran; Raghu Raghavan; Peter A. Sandborn
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Paper Abstract

The development of a miniature underwater weapon safety and arming system requires reliable chip-to-chip bonding of die that contain microelectromechanical actuators and sensors fabricated using a LIGA MEMS fabrication process. Chip-to- chip bonding is associated for several different bond materials (indium solder, thermoplastic paste, thermoplastic film and epoxy film), and bonding configurations (with an alloy 42 spacer, silicon to ceramic, and silicon to silicon). Metrology using acoustic micro imaging has been developed to determine the fraction of delamination of samples.

Paper Details

Date Published: 18 August 1999
PDF: 8 pages
Proc. SPIE 3880, MEMS Reliability for Critical and Space Applications, (18 August 1999); doi: 10.1117/12.359360
Show Author Affiliations
Gowrishankar Subramanian, Univ. of Maryland/College Park (United States)
Michael Deeds, Naval Surface Warfare Ctr. (United States)
Kevin R. Cochran, Naval Surface Warfare Ctr. (United States)
Raghu Raghavan, Univ. of Maryland/College Park (Singapore)
Peter A. Sandborn, Univ. of Maryland/College Park (United States)


Published in SPIE Proceedings Vol. 3880:
MEMS Reliability for Critical and Space Applications
Russell A. Lawton; William M. Miller; Gisela Lin; Rajeshuni Ramesham, Editor(s)

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