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Proceedings Paper

Computational analysis of embedded droplet impingement for integrated cooling of electronics
Author(s): Chi-fu Wu; Jayathi Y. Murthy; S. C. Yao
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Paper Abstract

An embedded droplet impingement device is being designed for cooling electronic chip packages which utilizes the latent heat of vaporization of dielectric coolants and provides adaptive on-demand cooling. The device must generate micro- droplets in the 50 - 250 micron range and must be small enough to be embedded in the chip package. A simplex swirl atomizer is one of the designs being considered to generate the spray. This numerical study investigates the design and performance of a micro-scale simplex swirl atomizer. Alternative atomizer designs are considered, and the flow field inside the atomizer is computed over a range of operating parameters. Local and global flow quantities, including exit swirl velocity and pressure profiles, as well as overall pressure drop parameters are computed to characterize alternative designs. These indices are useful in predicting spray quality and in identifying important geometric variables.

Paper Details

Date Published: 19 August 1999
PDF: 11 pages
Proc. SPIE 3877, Microfluidic Devices and Systems II, (19 August 1999); doi: 10.1117/12.359347
Show Author Affiliations
Chi-fu Wu, Carnegie Mellon Univ. (United States)
Jayathi Y. Murthy, Carnegie Mellon Univ. (United States)
S. C. Yao, Carnegie Mellon Univ. (United States)


Published in SPIE Proceedings Vol. 3877:
Microfluidic Devices and Systems II
Chong Hyuk Ahn; A. Bruno Frazier, Editor(s)

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