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Proceedings Paper

Integratible process for fabrication of fluidic microduct networks on a single wafer
Author(s): Carolyn M. Matzke; Carol I. H. Ashby; Monica M. Bridges; Leonardo Griego; C. Channy Wong
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Paper Abstract

We present a microelectronics fabrication compatible process that comprises photolithography and a key room temperature SiON thin film plasma deposition to define and seal a fluidic microduct network. Our single wafer process is independent of thermo-mechanical material properties, particulate cleaning, global flatness, assembly alignment, and glue medium application, which are crucial for wafer fusion bonding or sealing techniques using a glue medium. From our preliminary experiments, we have identified a processing window to fabricate channels on silicon, glass and quartz substrates. Channels with a radius of curvature between 8 and 50 mm, are uniform along channel lengths of several inches and repeatable across the wafer surfaces. To further develop this technology, we have begun characterizing the SiON film properties such as elastic modulus using nanoindentation, and chemical bonding compatibility with other microelectric materials.

Paper Details

Date Published: 19 August 1999
PDF: 9 pages
Proc. SPIE 3877, Microfluidic Devices and Systems II, (19 August 1999); doi: 10.1117/12.359328
Show Author Affiliations
Carolyn M. Matzke, Sandia National Labs. (United States)
Carol I. H. Ashby, Sandia National Labs. (United States)
Monica M. Bridges, Sandia National Labs. (United States)
Leonardo Griego, Sandia National Labs. (United States)
C. Channy Wong, Sandia National Labs. (United States)


Published in SPIE Proceedings Vol. 3877:
Microfluidic Devices and Systems II
Chong Hyuk Ahn; A. Bruno Frazier, Editor(s)

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