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Proceedings Paper

Fabrication of polymer high-aspect-ratio structures with hot embossing for microfluidic applications
Author(s): Holger Becker; Ulf Heim; O. Roetting
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Paper Abstract

In this paper we present the fabrication technologies necessary for the high volume production of microfluidic devices, with specific emphasis on the hot embossing process and the parameters necessary for achieving high aspect ratio structures on substrate like polymethylmetacrylate or polycarbonate. In addition to the replication technology, we have investigated subsequent process steps like via hole drilling, bonding and dicing. Several examples for different microfluidic applications will be given.

Paper Details

Date Published: 19 August 1999
PDF: 6 pages
Proc. SPIE 3877, Microfluidic Devices and Systems II, (19 August 1999); doi: 10.1117/12.359323
Show Author Affiliations
Holger Becker, Jenoptik Mikrotechnik GmbH (Germany)
Ulf Heim, Jenoptik Mikrotechnik GmbH (Germany)
O. Roetting, Jenoptik Mikrotechnik GmbH (Germany)


Published in SPIE Proceedings Vol. 3877:
Microfluidic Devices and Systems II
Chong Hyuk Ahn; A. Bruno Frazier, Editor(s)

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