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Proceedings Paper

Flip-chip electronic system assembly process and issues for the NanoWalker: a small wireless autonomous instrumented robot
Author(s): Sylvain M. Martel; George A. Riley; Monisha Merchant; Ian Warwick Hunter; Serge Lafontaine
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Paper Abstract

The integration of complex electronic systems onto small- scale robots requires advanced assembly methods. The NanoWalker is an example of such a robot where a large amount of electronics must be embedded in the smallest possible space. To make a space-efficient implementation, electronic chips are mounted using flip chip technology on a pre-bumped flexible printed circuit (FPC). A 3D structure is obtained by mounting the FPC vertically in a triangular fashion above a tripod built with three small piezo-actuated legs used for the walking and rotational motions. Advanced computer aided design systems are used for the design and to generate manufacturing files. Unlike other commercial products such as cellular phones, watches, pagers, cameras, and disk drives that use flip chip technology to achieve the smallest form factor, the assembly process of the NanoWalker is directly dependent on other characteristics of the system. Minimization of coupling noises through proper FPC layout and die placement within temperature constraints due to the proximity of sensitive instrument was a critical factor. The effect of vibration caused by the piezo- actuators and the weight of each die were also other important issues to consider to determine the final placement in order to maintain proper sub-atomic motion behavior.

Paper Details

Date Published: 18 August 1999
PDF: 8 pages
Proc. SPIE 3834, Microrobotics and Microassembly, (18 August 1999); doi: 10.1117/12.357831
Show Author Affiliations
Sylvain M. Martel, Massachusetts Institute of Technology (United States)
George A. Riley, HyComp, Inc. (United States)
Monisha Merchant, Massachusetts Institute of Technology (United States)
Ian Warwick Hunter, Massachusetts Institute of Technology (United States)
Serge Lafontaine, Massachusetts Institute of Technology (United States)


Published in SPIE Proceedings Vol. 3834:
Microrobotics and Microassembly
Bradley J. Nelson; Jean-Marc Breguet, Editor(s)

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