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Proceedings Paper

Thermomechanical design of a microchannel cooled semiconductor laser diode array package
Author(s): Enchao C. Yu; Andrzej J. Przekwas
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Paper Details

Date Published: 6 August 1999
PDF: 8 pages
Proc. SPIE 3625, Physics and Simulation of Optoelectronic Devices VII, (6 August 1999); doi: 10.1117/12.356913
Show Author Affiliations
Enchao C. Yu, CFD Research Corp. (United States)
Andrzej J. Przekwas, CFD Research Corp. (United States)


Published in SPIE Proceedings Vol. 3625:
Physics and Simulation of Optoelectronic Devices VII
Peter Blood; Akira Ishibashi; Marek Osinski, Editor(s)

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