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Proceedings Paper

8x8 arrays of VCSEL/CMOS and photodetectors: optoelectronic interconnects
Author(s): John T. Pham; George J. Simonis; Jagadeesh Pamulapati; William B. Lawler; Paul H. Shen; J. Jiang Liu; Wayne H. Chang; Peter G. Newman; Monica Alba Taysing-Lara; Bikash Koley; Mario Dagenais
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Paper Abstract

We demonstrate an optoelectronic interconnect based on an 8 by 8 array of vertical-cavity surface-emitting lasers, an 8 by 8 array of photodetectors, and a single compound lens. The substrate-emitting VCSEL array and back-illuminated photodetector array were flip-chip bonded to a CMOS driver circuit and a Si fan-out pad array, respectively. The CMOS driver provides laser addressing, signal conditioning and modulation current.In this paper we will describe the interconnect configuration, device structures and characteristics, and CMOS driver circuits. We then discuss the system operation and performance.

Paper Details

Date Published: 26 July 1999
PDF: 7 pages
Proc. SPIE 3714, Enabling Photonic Technologies for Aerospace Applications, (26 July 1999); doi: 10.1117/12.354688
Show Author Affiliations
John T. Pham, U.S. Army Research Lab. (United States)
George J. Simonis, U.S. Army Research Lab. (United States)
Jagadeesh Pamulapati, U.S. Army Research Lab. (United States)
William B. Lawler, U.S. Army Research Lab. (United States)
Paul H. Shen, U.S. Army Research Lab. (United States)
J. Jiang Liu, U.S. Army Research Lab. (United States)
Wayne H. Chang, U.S. Army Research Lab. (United States)
Peter G. Newman, U.S. Army Research Lab. (United States)
Monica Alba Taysing-Lara, U.S. Army Research Lab. (United States)
Bikash Koley, Univ. of Maryland/College Park (United States)
Mario Dagenais, Univ. of Maryland/College Park (United States)


Published in SPIE Proceedings Vol. 3714:
Enabling Photonic Technologies for Aerospace Applications
Andrew R. Pirich; Edward W. Taylor, Editor(s)

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