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Proceedings Paper

Design and performance of a small low-power infrared imaging system
Author(s): John J. Forsthoefel; J. Brian Toft
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Paper Abstract

Cincinnati Electronics has developed a small, low power, lightweight thermal imaging system designed for portable, handheld, or OEM applications. The camera will support a 256 X 256 or 320 X 240 MWIR Indium Antimonide (InSb) staring FPA. The sensor is integrated to a high reliability rotary micro-cooler. The camera features include auto level and gain control, fast internal two point non-uniformity correction, a 14 bit data collection port, movable cursor, RS-422 remote operation, and in-field reconfiguration.

Paper Details

Date Published: 12 July 1999
PDF: 11 pages
Proc. SPIE 3701, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing X, (12 July 1999); doi: 10.1117/12.352983
Show Author Affiliations
John J. Forsthoefel, Cincinnati Electronics Corp. (United States)
J. Brian Toft, Cincinnati Electronics Corp. (United States)


Published in SPIE Proceedings Vol. 3701:
Infrared Imaging Systems: Design, Analysis, Modeling, and Testing X
Gerald C. Holst, Editor(s)

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