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Proceedings Paper

Maskless laser-induced deposition of Cu film patterns from copper formate
Author(s): Jaehwan Kim; Cheon Lee
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Paper Abstract

Laser direct writing using thin solid films of metallo- organic precursors offers some unique advantages in terms of materials design, process control, and safety over gas phase or solution processor. Micro patterned copper films were obtained by laser-induced deposition using Cu(HCOO)2 4H2O films as a precursor. Then the new applicabilities for interconnection of integrated circuits were preliminary studied by the estimation of physical and electrical properties of copper films after annealing. The growth kinetics of these Cu films was investigated as a function of the laser power and the scan speed which were varied in the range of 70 to 600 mW and 0.1 to 20 mm/s, respectively. The high-purity of the deposit was also confirmed by Auger electron spectroscopy analysis. The resistivity of the patterned copper films was a factor of about 20 higher than that of bulk value however, the resistivity decreased due to changes in morphology and porosity of the deposit and was about 10 (mu) (Omega) cm after annealing at 300 degrees C for 5 minutes.

Paper Details

Date Published: 15 July 1999
PDF: 8 pages
Proc. SPIE 3618, Laser Applications in Microelectronic and Optoelectronic Manufacturing IV, (15 July 1999); doi: 10.1117/12.352717
Show Author Affiliations
Jaehwan Kim, Inha Univ. (South Korea)
Cheon Lee, Inha Univ. (South Korea)

Published in SPIE Proceedings Vol. 3618:
Laser Applications in Microelectronic and Optoelectronic Manufacturing IV
Jan J. Dubowski; Henry Helvajian; Ernst-Wolfgang Kreutz; Koji Sugioka, Editor(s)

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